Project leader
ST MicroelectronicsPartners
Gemalto, Alcatel AMMS, Beamind, Fogale, CEA-LETI, ENSMSEFunders
FUI,![](https://www.pole-scs.org/wp-content/themes/polescs/assets/images/projet-innovant.png)
SMARTSTACK (ex-TRAVIATA)
3D circuit integration (3D IC) whose chip chip connections are provided by vias through silicon.
3D circuit integration (3D IC) whose chip chip connections are provided by vias through silicon.
Themes | Markets | R&D Investment | Duration | Funding Year |
---|---|---|---|---|
Microelectronics |
Other |
5526 K€ | 24 months | 2008 |